Copper plating
Plating treatment that utilizes thermal conductivity, electrical conductivity, and ductility.
Characteristics of Copper Plating - Good electrical conductivity Copper plating, which uses copper, achieves high electrical conductivity similar to that of copper itself (resistivity ρ×10^-8(Ω·m) 1.6 to 2.3, conductivity (%IACS) 75.0 to 107.8). Leveraging its excellent electrical conductivity, it is particularly active in the field of electrical equipment. - High thermal conductivity In addition to electrical conductivity, copper also excels in thermal conductivity. The thermal conductivity of copper is 0.94 [W/m·℃, allowing heat to be distributed quickly and evenly throughout the material. - Ideal as a base plating Copper plating is also valued as a base plating. For example, when it is necessary to plate materials that are difficult to plate directly, applying copper plating first as a base can improve adhesion to the material. Additionally, it provides uniformity, making it useful for the purpose of smoothing the surface of the substrate. - Polishing possible after plating Copper plating can also be buff polished after plating. By performing buff polishing as a finishing touch, it is possible to achieve a higher gloss. Buff polishing also expands the variety of decorative options.
- Company：三和メッキ工業
- Price：Other
